trodas
01-08-2007, 03:21 PM
I figured out I better ask twice (to be sorry once) before I start.
I have one old DFI LP2 board and it is unstable in the long run (15h of folding and crash)... I noticed how bad the NB chipset contact with cooler on is (almost hole in the middle of the plastic on chipset!) and going to lap it. How far I can go?
I read sometimes as far, as I see the cooper?
True?
http://www.slibe.com/imagestumb/188c18cd-nf2_chipset_temp.jpg (http://www.slibe.com/publicimage/188c18cd-nf2_chipset_temp/)
(the nF2 chipset has no visible metallic part ATM, DFI NF2 mobo)
Even w/o the lapping it can score fairy high O/C, so I wonder how I can take it with the lapp :D
edit: find some pics like in this guide: http://www.techarp.com/showarticle.aspx?artno=70&pgno=0
But looks like they just flatten out the surface? I would like get most of the temperature-resistant PVC out of way, so, what is why I asking how deep can I go. Till the little holes near corner disappear? Till I see cooper?
I have one old DFI LP2 board and it is unstable in the long run (15h of folding and crash)... I noticed how bad the NB chipset contact with cooler on is (almost hole in the middle of the plastic on chipset!) and going to lap it. How far I can go?
I read sometimes as far, as I see the cooper?
True?
http://www.slibe.com/imagestumb/188c18cd-nf2_chipset_temp.jpg (http://www.slibe.com/publicimage/188c18cd-nf2_chipset_temp/)
(the nF2 chipset has no visible metallic part ATM, DFI NF2 mobo)
Even w/o the lapping it can score fairy high O/C, so I wonder how I can take it with the lapp :D
edit: find some pics like in this guide: http://www.techarp.com/showarticle.aspx?artno=70&pgno=0
But looks like they just flatten out the surface? I would like get most of the temperature-resistant PVC out of way, so, what is why I asking how deep can I go. Till the little holes near corner disappear? Till I see cooper?